Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

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Engelsk
836 sider

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Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:Autonomous, Hybrid, and Electric VehiclesEnergy Conversion and StorageFlexible and Wearable ElectronicsHeterogeneous IntegrationInternet of ThingsPhotonics and OpticsPower ElectronicsServers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions andService to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Coolingof Server Systems

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Detaljer

SprogEngelsk
Sidetal836
Udgivelsesdato30-06-2020
ISBN139780791859322
Forlag American Society Of Mechanical Engineers,U.S.
FormatPaperback

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

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