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MEMS Packaging Technologies and 3D Integration

Forfatter: info mangler
Bog
  • Format
  • Bog, hardback
  • Engelsk
  • 210 sider

Beskrivelse

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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Detaljer
  • SprogEngelsk
  • Sidetal210
  • Udgivelsesdato01-06-2022
  • ISBN139783036542584
  • Forlag Mdpi AG
  • FormatHardback
  • Udgave0
Størrelse og vægt
  • Vægt653 g
  • Dybde1,7 cm
  • coffee cup img
    10 cm
    book img
    16,9 cm
    24,4 cm

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