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Area Array Packaging Processes

Bog
  • Format
  • Bog, paperback
  • Engelsk
  • 272 sider

Beskrivelse

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

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Detaljer
Størrelse og vægt
  • Vægt474 g
  • Dybde1,4 cm
  • coffee cup img
    10 cm
    book img
    23,5 cm
    19,1 cm

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    Machine Name: SAXO081