Over 10 mio. titler Fri fragt ved køb over 499,- Hurtig levering Forlænget returret til 31/01/25

3D IC Stacking Technology

  • Format
  • E-bog, ePub
  • Engelsk
  • 544 sider
E-bogen er DRM-beskyttet og kræver et særligt læseprogram

Beskrivelse

The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers:High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology

Læs hele beskrivelsen
Detaljer
  • SprogEngelsk
  • Sidetal544
  • Udgivelsesdato14-10-2011
  • ISBN139780071741965
  • Forlag McGraw-Hill Education
  • FormatePub

Findes i disse kategorier...

Se andre, der handler om...

Machine Name: SAXO082