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3D IC Stacking Technology

  • Format
  • E-bog, ePub
  • Engelsk
  • 544 sider
E-bogen er DRM-beskyttet og kræver et særligt læseprogram

Beskrivelse

The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers:High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology

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Detaljer
  • SprogEngelsk
  • Sidetal544
  • Udgivelsesdato14-10-2011
  • ISBN139780071741965
  • Forlag McGraw-Hill Education
  • FormatePub

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